Since there are no academic papers on this specific hardware model, you should look for these technical documents:
All component values, equations, and guidelines presented in this paper are original work derived from publicly available datasheet specifications and standard LDO design practice. No proprietary schematics have been reproduced.
Because "LA-F952P" is likely a custom OEM part number (specific to a manufacturer like Lenovo or Dell) rather than a generic public component number, there is rarely a direct "paper" (academic research) on it. Instead, the documentation you are looking for is likely a Datasheet, a Schematic Diagram, or a BoardView file. la-f952p schematic
Here is a breakdown of the resources related to this component and how to find its schematic:
[ P_DISS= (V_IN-V_OUT) \times I_OUT ]
Worst‑case (Vin = 6.5 V, I_OUT = 200 mA):
[ P_DISS= (6.5-3.3)\times0.2 = 0.64; \textW ] Since there are no academic papers on this
The SOT‑23‑5 package has a thermal resistance θJA ≈ 150 °C/W, yielding a junction rise of ≈ 96 °C above ambient. Therefore, in high‑temperature environments a copper pour under the device or a larger package should be considered.
If the board outputs the wrong voltage (e.g., 19V instead of 20V), the problem is likely in the feedback network. The schematic provides the exact values of the upper and lower feedback resistors (R_FB_T and R_FB_B), allowing you to calculate the expected output. If the board outputs the wrong voltage (e